Electronic component

ABSTRACT

An external electrode is disposed on an end of the element body in the first direction. The external electrode includes a pair of first electrode portions disposed on the pair of second side surfaces and including a conductive resin layer. Each of the pair of second side surfaces includes a region exposed from the external electrode. An insulating film is disposed on the element body. The insulating film includes film portions disposed on the pair of second side surfaces. Each of the film portions covers an edge of the conductive resin layer and the region of each of the second side surfaces along the edge of the conductive resin layer.

BACKGROUND OF THE INVENTION 1. Field of the Invention

The present invention relates to an electronic component.

2. Description of Related Art

Known electronic components include an element body of a rectangularparallelepiped shape, a plurality of external electrodes, and aplurality of internal electrodes (see, for example, Japanese UnexaminedPatent Publication No. 2018-006501). The element body includes a pair ofend surfaces opposing each other in a first direction, a pair of firstside surfaces opposing each other in a second direction, and a pair ofsecond side surfaces opposing each other in a third direction. Theplurality of external electrodes are disposed on both ends of theelement body in the first direction. The plurality of internalelectrodes are disposed in the element body to be distributed in thesecond direction, and are electrically connected to correspondingexternal electrodes of the plurality of external electrodes. Eachexternal electrode includes an electrode portion that is disposed on thesecond side surface and includes a conductive resin layer.

SUMMARY OF THE INVENTION

The conductive resin layer generally includes a plurality of metalparticles and a resin. In a configuration in which the externalelectrode includes a conductive resin layer, migration may occur in theexternal electrode. Migration is considered to occur due to thefollowing events, for example.

An electric field generated between the internal electrode and theconductive resin layer to which the internal electrode is notelectrically connected acts on the metal particle, and an atom of themetal particle is ionized. Generated metal ions are attracted by anelectric field generated between the external electrodes and migratesfrom the conductive resin layer. The metal ions migrating from theconductive resin layer react with, for example, an electron suppliedfrom the element body, and is deposited as metal on the surface of theelement body.

An object of each of aspects of the invention is to provide anelectronic component controlling occurrence of migration even when anexternal electrode includes a conductive resin layer.

An electronic component according to one aspect of the inventionincludes an element body of a rectangular parallelepiped shape, aplurality of external electrodes, a plurality of internal electrodes,and an insulating film disposed on the element body. The element bodyincludes a pair of end surfaces opposing each other in a firstdirection, a pair of first side surfaces opposing each other in a seconddirection, and a pair of second side surfaces opposing each other in athird direction. The plurality of external electrodes are disposed onboth ends of the element body in the first direction. The plurality ofinternal electrodes are disposed in the element body to be distributedin the second direction, and is electrically connected to correspondingexternal electrodes of the plurality of external electrodes. Each of theplurality of external electrodes includes a pair of first electrodeportions disposed on the pair of second side surfaces and including aconductive resin layer. Each of the pair of second side surfacesincludes a region exposed from the external electrode. The insulatingfilm includes film portions disposed on the pair of second sidesurfaces. Each of the film portions covers an edge of the conductiveresin layer and the region of each of the second side surfaces along theedge of the conductive resin layer.

In the one aspect described above, the film portion of the insulatingfilm covers the edge of the conductive resin layer included in the firstelectrode portion. Therefore, metal ions tend not to migrate from theconductive resin layer of the first electrode portion even in a casewhere the metal ions are generated in the conductive resin layer of thefirst electrode portion due to an electric field generated between theinternal electrode and the conductive resin layer of the first electrodeportion not electrically connected to the internal electrode. The filmportion of the insulating film regulates migration of the metal ions.Consequently, the one aspect controls occurrence of the migration.

In the one aspect described above, each of the plurality of externalelectrodes may include a pair of second electrode portions disposed onthe pair of first side surfaces and including a conductive resin layer.Each of the pair of first side surfaces may include a region exposedfrom the external electrode. The insulating film may include other filmportions disposed on the pair of first side surfaces. Each of the otherfilm portions may cover an edge of the conductive resin layer includedin the second electrode portion and the region of each of the first sidesurfaces along the edge of the conductive resin layer included in thesecond electrode portion.

In a configuration in which the insulating film includes the other filmportion, the other film portion covers the edge of the conductive resinlayer included in the second electrode portion. Therefore, metal ionstend not to migrate from the conductive resin layer of the secondelectrode portion even in a case where the metal ions are generated inthe conductive resin layer of the second electrode portion due to anelectric field generated between an outermost internal electrode and theconductive resin layer of the second electrode portion not electricallyconnected to the outermost internal electrode. The other film portionregulates migration of the metal ions. The outermost internal electrodeis located outermost in the second direction among the plurality ofinternal electrodes. Consequently, the configuration in which theinsulating film includes the other film portion further controls theoccurrence of the migration.

In the one aspect described above, the conductive resin layer mayinclude a plurality of silver particles.

An electronic component according to another aspect of the inventionincludes an element body of a rectangular parallelepiped shape, aplurality of external electrodes, and a plurality of internalelectrodes. The element body includes a pair of end surfaces opposingeach other in a first direction, a pair of first side surfaces opposingeach other in a second direction, and a pair of second side surfacesopposing each other in a third direction. The plurality of externalelectrodes are disposed on both ends of the element body in the firstdirection. The plurality of internal electrodes are disposed in theelement body to be distributed in the second direction, and areelectrically connected to corresponding external electrodes of theplurality of external electrodes. Each of the plurality of externalelectrodes includes a pair of first electrode portions disposed on thepair of second side surfaces and including a conductive resin layer. Foreach of the two conductive resin layers located on the same second sidesurface, one conductive resin layer includes an edge opposing anotherconductive resin layer. The conductive resin layer includes: a firstregion including a plurality of metal particles of a first content and aresin; and a second region including a plurality of metal particles of asecond content and a resin. The second content is smaller than the firstcontent. The second region is located closer to the edge of theconductive resin layer than the first region, and includes the edge ofthe conductive resin layer.

In the other aspect described above, the second region constitutes theedge of the conductive resin layer included in the first electrodeportion. The content of the plurality of metal particles in the secondregion is smaller than the content of the plurality of metal particlesin the first region. An amount of metal ions generated in the secondregion is smaller than that in the first region even in a case where themetal ions are generated in the conductive resin layer of the firstelectrode portion due to an electric field generated between theinternal electrode and the conductive resin layer of the first electrodeportion not electrically connected to the internal electrode. Therefore,an amount of the metal ions migrating from the conductive resin layer ofthe first electrode portion in the configuration in which the conductiveresin layer of the first electrode portion includes the second region issmall, as compared with that in the configuration in which theconductive resin layer of the first electrode portion includes only thefirst region. Consequently, the other aspect described above controlsoccurrence of migration.

In the other aspect described above, each of the plurality of externalelectrodes may include a pair of second electrode portions disposed onthe pair of first side surfaces and including a conductive resin layer.For each of the two conductive resin layers located on the same firstside surface, one conductive resin layer may include an edge opposinganother conductive resin layer. The conductive resin layer included inthe second electrode portion may include: a third region including aplurality of metal particles of a third content and a resin; and afourth region including a plurality of metal particles of a fourthcontent and a resin. The fourth region may be located closer to the edgeof the conductive resin layer than the third region and include the edgeof the conductive resin layer. In this case, the fourth content issmaller than the third content.

In a configuration in which the conductive resin layer included in thesecond electrode portion includes the fourth region, the fourth regionconstitutes the edge of the conductive resin layer included in thesecond electrode portion. The content of the plurality of metalparticles in the fourth region is smaller than the content of theplurality of metal particles in the third region. An amount of metalions generated in the fourth region is small, as compared with that inthe third region even in a case where the metal ions are generated inthe conductive resin layer of the second electrode portion due to anelectric field generated between an outermost internal electrode and theconductive resin layer of the second electrode portion not electricallyconnected to the outermost internal electrode. Therefore, an amount ofmetal ions migrating from the conductive resin layer of the secondelectrode portion in the configuration in which the conductive resinlayer of the second electrode portion includes the fourth region issmall, as compared with that in the configuration in which theconductive resin layer of the second electrode portion includes only thethird region. The outermost internal electrode is located outermost inthe second direction among the plurality of internal electrodes.Consequently, the configuration in which the conductive resin layer ofthe second electrode portion includes the fourth region further controlsthe occurrence of the migration.

In another aspect described above, the metal particles may includesilver particles.

In each of the aspects described above, each of the plurality ofexternal electrodes may include a pair of second electrode portionsdisposed on the pair of first side surfaces and including a conductiveresin layer. For each of the two conductive resin layers located on thesame first side surface, one conductive resin layer may include an edgeopposing another conductive resin layer. An outermost internal electrodemay be adjacent in the second direction to the second electrode portionto which the outermost internal electrode is electrically connected. Afirst length of the outermost internal electrode in the first directionfrom a reference plane may be larger than a second length in the firstdirection from the reference plane to the edge of the conductive resinlayer electrically connected to the outermost internal electrode andincluded in the second electrode portion, and smaller than a thirdlength from the reference plane to the edge of the conductive resinlayer not electrically connected to the outermost internal electrode andincluded in the second electrode portion. In this case, the outermostinternal electrode is located outermost in the second direction amongthe plurality of internal electrodes. The reference plane includes theend surface to which the outermost internal electrode is exposed.

In a configuration in which the first length is larger than the secondlength, the internal electrode adjacent to the outermost internalelectrode in the second direction and the conductive resin layerincluded in the second electrode portion adjacent to the same outermostinternal electrode in the second direction are not electricallyconnected to each other, and tend not to oppose each other in the seconddirection. An electric field tends not to be generated between theconductive resin layer and the internal electrode that are notelectrically connected to each other.

In a configuration in which the first length is smaller than the thirdlength, the outermost internal electrode tends not to oppose theconductive resin layer included in the second electrode portion notelectrically connected to the outermost internal electrode, in thesecond direction. An electric field tends not to be generated betweenthe conductive resin layer and the outermost internal electrode that arenot electrically connected to each other.

Consequently, the configuration in which the first length is larger thanthe second length and smaller than the third length further controls theoccurrence of the migration.

Each of the aspects described above may include a dummy conductorlocated in the same layer as the outermost internal electrode andseparated from the outermost internal electrode. The dummy conductor maybe electrically connected to the external electrode to which theoutermost internal electrode located in the same layer as the dummyconductor is not electrically connected.

In the configuration in which the dummy conductor is located in the samelayer as the outermost internal electrode, structural defects tend notto occur in the element body.

Each of the aspects described above may include a pair of dummyconductors. In this case, each of the pair of dummy conductors isadjacent to a corresponding first side surface of the pair of first sidesurfaces in the second direction. Each of the plurality of externalelectrodes may include a pair of second electrode portions disposed onthe pair of first side surfaces and including a conductive resin layer.Each of the pair of dummy conductors may oppose the conductive resinlayer not electrically connected the internal electrode adjacent to thedummy conductor in the second direction and included in the secondelectrode portion, in the second direction.

In a configuration including the dummy conductor, the dummy conductor islocated between the conductive resin layer included in the secondelectrode portion and the internal electrode not electrically connectedto the conductive resin layer of the second electrode portion. The dummyconductor separates the conductive resin layer of the second electrodeportion from the internal electrode not electrically connected to theconductive resin layer of the second electrode portion. Therefore, anelectric field tends not to be generated between the conductive resinlayer of the second electrode portion and the internal electrode notelectrically connected to the conductive resin layer of the secondelectrode portion. Even in a case where an electric field is generatedbetween the conductive resin layer of the second electrode portion andthe internal electrode not electrically connected to the conductiveresin layer of the second electrode portion, strength of the electricfield is small. Consequently, the configuration including the dummyconductor further controls the occurrence of the migration.

In each of the aspects described above, each of the plurality ofexternal electrodes may include an electrode portion disposed on the endsurface and including a conductive resin layer.

A configuration in which the external electrode includes the electrodeportion disposed on the end surface and including the conductive resinlayer reduces stress acting on a solder fillet formed on the electrodeportion, and then controls occurrence of solder cracks.

The present invention will become more fully understood from thedetailed description given hereinafter and the accompanying drawingswhich are given by way of illustration only, and thus are not to beconsidered as limiting the present invention.

Further scope of applicability of the present invention will becomeapparent from the detailed description given hereinafter. However, itshould be understood that the detailed description and specificexamples, while indicating embodiments of the invention, are given byway of illustration only, since various changes and modifications withinthe spirit and scope of the invention will become apparent to thoseskilled in the art from this detailed description.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a perspective view of a multilayer capacitor according to afirst embodiment;

FIG. 2 is a view illustrating a cross-sectional configuration of themultilayer capacitor according to the first embodiment;

FIG. 3 is a view illustrating a cross-sectional configuration of themultilayer capacitor according to the first embodiment;

FIG. 4 is a view illustrating a second electrode layer and an insulatingfilm;

FIG. 5 is a view illustrating the second electrode layer and theinsulating film;

FIG. 6 is a view illustrating a mounting structure of the multilayercapacitor according to the first embodiment;

FIG. 7 is a view illustrating a cross-sectional configuration of amultilayer capacitor according to a modification of the firstembodiment;

FIG. 8 is a view illustrating a cross-sectional configuration of amultilayer capacitor according to a modification of the firstembodiment;

FIG. 9 is a view illustrating a cross-sectional configuration of amultilayer capacitor according to a modification of the firstembodiment;

FIG. 10 is a view illustrating a cross-sectional configuration of themultilayer capacitor according to the modification of the firstembodiment;

FIG. 11 is a view illustrating a cross-sectional configuration of themultilayer capacitor according to the modification of the firstembodiment;

FIG. 12 is a view illustrating a cross-sectional configuration of amultilayer capacitor according to a modification of the firstembodiment;

FIG. 13 is a view illustrating a cross-sectional configuration of themultilayer capacitor according to the modification of the firstembodiment;

FIG. 14 is a view illustrating a cross-sectional configuration of themultilayer capacitor according to the modification of the firstembodiment;

FIG. 15 is a view illustrating a cross-sectional configuration of amultilayer capacitor according to a modification of the firstembodiment;

FIG. 16 is a view illustrating a e cross-sectional configuration of themultilayer capacitor according to the modification of the firstembodiment;

FIG. 17 is a view illustrating a cross-sectional configuration of themultilayer capacitor according to the modification of the firstembodiment;

FIG. 18 is a view illustrating a cross-sectional configuration of amultilayer capacitor according to a modification of the firstembodiment;

FIG. 19 is a view illustrating a cross-sectional configuration of themultilayer capacitor according to the modification of the firstembodiment;

FIG. 20 is a perspective view of a multilayer capacitor according to asecond embodiment;

FIG. 21 is a view illustrating a cross-sectional configuration of themultilayer capacitor according to the second embodiment;

FIG. 22 is a view illustrating a cross-sectional configuration of themultilayer capacitor according to the second embodiment;

FIG. 23 is a view illustrating a cross-sectional configuration of amultilayer capacitor according to a modification of the secondembodiment;

FIG. 24 is a view illustrating a cross-sectional configuration of amultilayer capacitor according to a modification of the secondembodiment;

FIG. 25 is a view illustrating a cross-sectional configuration of amultilayer capacitor according to a modification of the secondembodiment;

FIG. 26 is a view illustrating a cross-sectional configuration of themultilayer capacitor according to the modification of the secondembodiment;

FIG. 27 is a view illustrating a cross-sectional configuration of themultilayer capacitor according to the modification of the secondembodiment;

FIG. 28 is a view illustrating a cross-sectional configuration of amultilayer capacitor according to a modification of the secondembodiment;

FIG. 29 is a view illustrating a cross-sectional configuration of themultilayer capacitor according to the modification of the secondembodiment;

FIG. 30 is a view illustrating a cross-sectional configuration of themultilayer capacitor according to the modification of the secondembodiment;

FIG. 31 is a view illustrating a cross-sectional configuration of amultilayer capacitor according to a modification of the secondembodiment;

FIG. 32 is a view illustrating a cross-sectional configuration of themultilayer capacitor according to the modification of the secondembodiment; and

FIG. 33 is a view illustrating a cross-sectional configuration of themultilayer capacitor according to the modification of the secondembodiment.

DETAILED DESCRIPTION OF EMBODIMENTS

Hereinafter, embodiments of the present invention will be described indetail with reference to the accompanying drawings. In the followingdescription, the same elements or elements having the same functions aredenoted with the same reference numerals and overlapped explanation isomitted.

First Embodiment

A configuration of a multilayer capacitor C1 according to a firstembodiment will be described with reference to FIGS. 1 to 3. FIG. 1 is aperspective view of a multilayer capacitor according to the firstembodiment. FIGS. 2 and 3 are views illustrating a cross-sectionalconfiguration of the multilayer capacitor according to the firstembodiment. In the present embodiment, an electronic component includes,for example, the multilayer capacitor C1.

As illustrated in FIG. 1, the multilayer capacitor C1 includes anelement body 3 of a rectangular parallelepiped shape and a plurality ofexternal electrodes 5. In the present embodiment, the multilayercapacitor C1 includes a pair of external electrodes 5. The pair ofexternal electrodes 5 are disposed on an outer surface of the elementbody 3. The pair of external electrodes 5 are separated from each other.The rectangular parallelepiped shape includes a rectangularparallelepiped shape in which corners and ridges are chamfered, and arectangular parallelepiped shape in which the corners and ridges arerounded.

The element body 3 includes a pair of side surfaces 3 a opposing eachother, a pair of side surfaces 3 c opposing each other, and a pair ofend surfaces 3 e opposing each other. The pair of side surfaces 3 a, thepair of side surfaces 3 c, and the pair of end surfaces 3 e each have arectangular shape. The pair of side surfaces 3 a oppose each other in asecond direction D2. The pair of side surfaces 3 c oppose each other ina third direction D3. The pair of end surfaces 3 e oppose each other ina first direction D1. The multilayer capacitor C1 is solder-mounted onan electronic device. The electronic device includes, for example, acircuit board or an electronic component. In the multilayer capacitorC1, one side surface 3 a opposes the electronic device. The one sidesurface 3 a is arranged to constitute a mounting surface. The one sidesurface 3 a is the mounting surface. One side surface 3 c of the pair ofside surfaces 3 c may be arranged to constitute a mounting surface. Forexample, in a case where the side surface 3 a constitutes a first sidesurface, the side surface 3 c constitutes a second side surface.

The second direction D2 is a direction orthogonal to each side surface 3a, and is orthogonal to the third direction D3. The first direction D1is a direction parallel to each side surface 3 a and each side surface 3c, and is orthogonal to the second direction D2 and the third directionD3. The third direction D3 is a direction orthogonal to each sidesurface 3 c, and the first direction D1 is a direction orthogonal toeach end surface 3 e. In the present embodiment, a length of the elementbody 3 in the first direction D1 is larger than a length of the elementbody 3 in the second direction D2 and larger than a length of theelement body 3 in the third direction D3. The first direction D1 is alongitudinal direction of the element body 3. The length of the elementbody 3 in the second direction D2 and the length of the element body 3in the third direction D3 may be equal to each other. The length of theelement body 3 in the second direction D2 and the length of the elementbody 3 in the third direction D3 may be different.

The length of the element body 3 in the second direction D2 is a heightof the element body 3. The length of the element body 3 in the thirddirection D3 is a width of the element body 3. The length of the elementbody 3 in the first direction D1 is a length of the element body 3. Inthe present embodiment, the height of the element body 3 is 0.1 to 2.5mm, the width of the element body 3 is 0.1 to 5.0 mm, and the length ofthe element body 3 is 0.2 to 5.7 mm. For example, the height of theelement body 3 is 2.5 mm, the width of the element body 3 is 2.5 mm, andthe length of the element body 3 is 3.2 mm.

The pair of side surfaces 3 c extend in the second direction D2 tocouple the pair of side surfaces 3 a to each other. The pair of sidesurfaces 3 c also extend in the first direction D1. The pair of endsurfaces 3 e extend in the second direction D2 to couple the pair ofside surfaces 3 a to each other. The pair of end surfaces 3 e alsoextend in the third direction D3.

The element body 3 includes four ridge portions 3 g, four ridge portions3 i, and four ridge portions 3 j. The ridge portion 3 g is locatedbetween the end surface 3 e and the side surface 3 a. The ridge portion3 i is located between the end surface 3 e and the side surface 3 c. Theridge portion 3 j is located between the side surface 3 a and the sidesurface 3 c. In the present embodiment, the ridge portions 3 g, 3 i, and3 j are rounded to be curved. The element body 3 is subjected to what iscalled a round chamfering process. The end surface 3 e and the sidesurface 3 a are indirectly adjacent to each other with the ridge portion3 g interposed therebetween. The end surface 3 e and the side surface 3c are indirectly adjacent to each other with the ridge portion 3 iinterposed therebetween. The side surface 3 a and the side surface 3 care indirectly adjacent to each other with the ridge portion 3 jinterposed therebetween.

The element body 3 is configured through laminating a plurality ofdielectric layers in the second direction D2. The element body 3includes a plurality of laminated dielectric layers. In the element body3, a lamination direction of the plurality of dielectric layerscoincides with the second direction D2. Each dielectric layer includes,for example, a sintered element body of a ceramic green sheet containinga dielectric material. Examples of the dielectric material includedielectric ceramics. Examples of the dielectric ceramics includeBaTiO₃-based, Ba(Ti, Zr)O₃-based, and (Ba, Ca)TiO₃-based dielectricceramics. In the actual element body 3, each of the dielectric layers isintegrated to such an extent that a boundary between the dielectriclayers cannot be visually recognized.

As illustrated in FIGS. 2 and 3, the multilayer capacitor C1 includes aplurality of internal electrodes 7 and a plurality of internalelectrodes 9. Each of the internal electrodes 7 and 9 is an internalconductor disposed in the element body 3. Each of the internalelectrodes 7 and 9 is made of an electrically conductive material thatis commonly used as an internal conductor of a multilayer electroniccomponent. The electrically conductive material includes, for example, abase metal. The electrically conductive material includes, for example,Ni or Cu. Each of the internal electrodes 7 and 9 is configured as asintered body of electrically conductive paste containing theelectrically conductive material described above. In the presentembodiment, the internal electrodes 7 and 9 are made of Ni.

The internal electrodes 7 and the internal electrodes 9 are disposed indifferent positions (layers) in the second direction D2. The internalelectrodes 7 and the internal electrodes 9 are alternately disposed inthe element body 3 to oppose each other in the second direction D2 withan interval therebetween. The internal electrodes 7 and the internalelectrodes 9 have different polarities from each other. One end of eachof the internal electrodes 7 and 9 is exposed to a corresponding endsurface 3 e of the pair of end surfaces 3 e. Each of the internalelectrodes 7 and 9 includes the one end exposed to the corresponding endsurface 3 e.

The plurality of internal electrodes 7 and the plurality of internalelectrodes 9 are alternately disposed in the second direction D2. Theplurality of internal electrodes 7 and the plurality of internalelectrodes 9 are disposed in the element body 3 to be distributed in thesecond direction D2. Each of the plurality of internal electrodes 7 andthe plurality of internal electrodes 9 is located in a planeapproximately parallel to the side surface 3 a. The internal electrode 7and the internal electrode 9 oppose each other in the second directionD2. The direction (second direction D2) in which the internal electrode7 and the internal electrode 9 oppose each other is orthogonal to adirection parallel to the side surface 3 a (third direction D3 and firstdirection D1).

In the present embodiment, the plurality of internal electrodes 7include one internal electrode 7A located outermost in the seconddirection D2. The internal electrode 7A is an outermost internalelectrode.

In the present embodiment, the plurality of internal electrodes 9include one internal electrode 9A located outermost in the seconddirection D2. The internal electrode 9A is an outermost internalelectrode.

In FIG. 3, for the sake of explanation, the internal electrodes 7 and 9(internal electrodes 7A and 9A) are intentionally illustrated so as todeviate from each other in the third direction D3.

As illustrated in FIG. 1, the external electrodes 5 are disposed at bothends of the element body 3 in the first direction D1. Each externalelectrode 5 is disposed on the corresponding end surface 3 e side of theelement body 3. In the present embodiment, each external electrode 5 iselement on the pair of side surfaces 3 a, the pair of side surfaces 3 c,and the end surface 3 e. The external electrode 5 includes a pluralityof electrode portions 5 a, 5 c, and 5 e as illustrated in FIGS. 2 and 3.The electrode portion 5 a is disposed on the side surface 3 a and on theridge portion 3 g. Each electrode portion 5 c is disposed on the sidesurface 3 c and on the ridge portion 3 i. The electrode portion 5 e isdisposed on the end surface 3 e. The external electrode 5 also includesan electrode portion disposed on the ridge portion 3 j.

The external electrodes 5 are formed on the five surfaces of the pair ofside surfaces 3 a, the end surface 3 e, and the pair of side surfaces 3c and the ridge portions 3 g, 3 i, and 3 j. The electrode portions 5 a,5 c, and 5 e adjacent to each other are coupled and are electricallyconnected to each other. The electrode portion 5 e covers all the oneends of the corresponding internal electrodes 7 and 9 of the pluralityof internal electrodes 7 and 9. The electrode portion 5 e is directlyconnected to the corresponding internal electrodes 7 and 9. The externalelectrode 5 is electrically connected to the corresponding internalelectrodes 7 and 9. As illustrated in FIGS. 2 and 3, the externalelectrode 5 includes a first electrode layer E1, a second electrodelayer E2, and a third electrode layer E3. The third electrode layer E3is arranged to constitute the outermost layer of the external electrode5. Each of the electrode portions 5 a and 5 c includes the firstelectrode layer E1, the second electrode layer E2, and the thirdelectrode layer E3. Each electrode portion 5 e includes the firstelectrode layer E1 and the third electrode layer E3.

The first electrode layer E1 of the electrode portion 5 a is disposed onthe side surface 3 a and the ridge portion 3 g. The first electrodelayer E1 of the electrode portion 5 a is formed to cover one part of theside surface 3 a and the entire ridge portion 3 g. The first electrodelayer E1 of the electrode portion 5 a is in contact with theabove-described one part of the side surface 3 a and the entire ridgeportion 3 g. In the electrode portion 5 a, the first electrode layer E1is in direct contact with the element body 3. The side surface 3 a iscovered with the first electrode layer E1 at the above-described onepart, and is exposed from the first electrode layer E1 at the remainingpart except the above-described one part. The above-described one partof the side surface 3 a is a partial region near the end surface 3 e, inthe side surface 3 a. The first electrode layer E1 of the electrodeportion 5 a is located on the side surface 3 a. The first electrodelayer E1 may not be formed on the side surface 3 a. The first electrodelayer E1 may not be disposed on the side surface 3 a.

The second electrode layer E2 of the electrode portion 5 a is disposedon the first electrode layer E1 and on the side surface 3 a. In theelectrode portion 5 a, the second electrode layer E2 is formed to coverthe first electrode layer E1 and a part of the side surface 3 a. In theelectrode portion 5 a, the second electrode layer E2 is in directcontact with the first electrode layer E1 and the side surface 3 a. Thesecond electrode layer E2 of the electrode portion 5 a is formed tocover the first electrode layer E1 of the electrode portion 5 a. In theelectrode portion 5 a, the second electrode layer E2 indirectly coversthe side surface 3 a in such a manner that the first electrode layer E1is located between the second electrode layer E2 and the side surface 3a. The second electrode layer E2 of the electrode portion 5 a is locatedon the side surface 3 a.

The third electrode layer E3 of the electrode portion 5 a is disposed onthe second electrode layer E2. In the electrode portion 5 a, the thirdelectrode layer E3 covers the second electrode layer E2. In theelectrode portion 5 a, the third electrode layer E3 is in contact withthe second electrode layer E2. In the electrode portion 5 a, the thirdelectrode layer E3 is in direct contact with the second electrode layerE2. In the electrode portion 5 a, the third electrode layer E3 is not indirect contact with the first electrode layer E1. The third electrodelayer E3 of the electrode portion 5 a is located on the side surface 3a.

The first electrode layer E1 of the electrode portion 5 c is disposed onthe side surface 3 c and the ridge portion 3 i. The first electrodelayer E1 of the electrode portion 5 c is formed to cover one part of theside surface 3 c and the entire ridge portion 3 i. The first electrodelayer E1 of the electrode portion 5 c is in contact with theabove-described one part of the side surface 3 c and the entire ridgeportion 3 i. In the electrode portion 5 c, the first electrode layer E1is in direct contact with the element body 3. The side surface 3 c iscovered with the first electrode layer E1 at the above-described onepart, and is exposed from the first electrode layer E1 at the remainingpart except the above-described one part. The above-described one partof the side surface 3 c is a partial region near the end surface 3 e, inthe side surface 3 c. The first electrode layer E1 of the electrodeportion 5 c is located on the side surface 3 c. The first electrodelayer E1 may not be formed on the side surface 3 c. The first electrodelayer E1 may not be disposed on the side surface 3 c.

The second electrode layer E2 of the electrode portion 5 c is disposedon the first electrode layer E1 and on the side surface 3 c. In theelectrode portion 5 c, the second electrode layer E2 is formed to coverthe first electrode layer E1 and a part of the side surface 3 c. In theelectrode portion 5 c, the second electrode layer E2 is in directcontact with the first electrode layer E1 and the side surface 3 c. Thesecond electrode layer E2 of the electrode portion 5 c is formed tocover the first electrode layer E1 of the electrode portion 5 c. In theelectrode portion 5 c, the second electrode layer E2 indirectly coversthe side surface 3 c in such a manner that the first electrode layer E1is located between the second electrode layer E2 and the side surface 3c. The second electrode layer E2 of the electrode portion 5 c is locatedon the side surface 3 c.

The third electrode layer E3 of the electrode portion 5 c is disposed onthe second electrode layer E2. In the electrode portion 5 c, the thirdelectrode layer E3 covers the second electrode layer E2. In theelectrode portion 5 c, the third electrode layer E3 is in contact withthe second electrode layer E2. In the electrode portion 5 c, the thirdelectrode layer E3 is in direct contact with the second electrode layerE2. In the electrode portion 5 c, the third electrode layer E3 is not indirect contact with the first electrode layer E1. The third electrodelayer E3 of the electrode portion 5 c is located on the side surface 3c.

The first electrode layer E1 of the electrode portion 5 e is disposed onthe end surface 3 e. The first electrode layer E1 of the electrodeportion 5 e is formed to cover the entire end surface 3 e. The firstelectrode layer E1 of the electrode portion 5 e is in contact with theentire end surface 3 e. In the electrode portion 5 e, the firstelectrode layer E1 is in direct contact with the end surface 3 e.

The third electrode layer E3 of the electrode portion 5 e is disposed onthe first electrode layer E1. In the electrode portion 5 e, the thirdelectrode layer E3 covers the entire first electrode layer E1. In theelectrode portion 5 e, the third electrode layer E3 is in contact withthe entire first electrode layer E1. In the electrode portion 5 e, thethird electrode layer E3 is in direct contact with the first electrodelayer E1. The third electrode layer E3 of the electrode portion 5 e islocated on the end surface 3 e.

The first electrode layer E1 is formed from sintering electricallyconductive paste applied onto the surface of the element body 3. Thefirst electrode layer E1 is formed to cover the above-described one partof the side surface 3 a, the above-described one part of the sidesurface 3 c, the end surface 3 e, and the ridge portions 3 g, 3 i, and 3j. The first electrode layer E1 is formed from sintering a metalcomponent contained in the electrically conductive paste. The metalcomponent contained in the electrically conductive paste includes, forexample, a metal particle. The first electrode layer E1 includes asintered metal layer. The first electrode layer E1 includes a sinteredmetal layer formed on the element body 3. In the present embodiment, thefirst electrode layer E1 includes a sintered metal layer made of Cu. Thefirst electrode layer E1 may include a sintered metal layer made of Ni.The first electrode layer E1 contains a base metal. The electricallyconductive paste contains, for example, particles formed of Cu or Ni, aglass component, an organic binder, and an organic solvent. The firstelectrode layer E1 included in each of the electrode portions 5 a, 5 c,and 5 e is integrally formed.

The second electrode layer E2 is formed from curing electricallyconductive resin applied onto the first electrode layer E1 and theelement body 3. The second electrode layer E2 is formed on the firstelectrode layer E1 and the element body 3. The first electrode layer E1is an underlying metal layer for forming the second electrode layer E2.The second electrode layer E2 is an electrically conductive resin layerthat covers the first electrode layer E1. The conductive resin contains,for example, a resin, an electrically conductive material, and anorganic solvent. The resin includes, for example, a thermosetting resin.The conductive material includes, for example, metal particles. Metalparticles include, for example, silver particles or copper particles. Inthe present embodiment, the second electrode layer E2 includes aplurality of silver particles. The second electrode layer E2 includes aplurality of metal particles. The thermosetting resin is, for example, aphenol resin, an acrylic resin, a silicone resin, an epoxy resin, or apolyimide resin. The second electrode layer E2 is in contact with a partof the ridge portion 3 j. The second electrode layer E2 included in eachof the electrode portions 5 a and 5 c is integrally formed.

The third electrode layer E3 is formed on the second electrode layer E2and on the first electrode layer E1 (a portion exposed from the secondelectrode layer E2) through a plating method. The third electrode layerE3 may have a multilayer structure. In this case, the third electrodelayer E3 includes, for example, an Ni plating layer and a solder platinglayer. The Ni plating layer is formed on the second electrode layer E2and on the first electrode layer E1. The solder plating layer is formedon the Ni plating layer. The solder plating layer covers the Ni platinglayer. The Ni plating layer has better solder leach resistance than themetal contained in the second electrode layer E2. The third electrodelayer E3 may include an Sn plating layer, a Cu plating layer, or an Auplating layer instead of the Ni plating layer. The solder plating layerincludes, for example, an Sn plating layer, an Sn—Ag alloy platinglayer, an Sn—Bi alloy plating layer, or an Sn—Cu alloy plating layer.The third electrode layer E3 included in each of the electrode portions5 a, 5 c, and 5 e is integrally formed.

For example, in a case where the electrode portion 5 c constitutes afirst electrode portion, the electrode portion 5 a constitutes a secondelectrode portion. In the present embodiment, the electrode portion 5 edoes not include the second electrode layer E2.

The multilayer capacitor C1 includes an insulating film 21 asillustrated in FIGS. 2 and 3. The insulating film 21 is disposed on theelement body 3. The insulating film 21 includes a film portion 21 adisposed on each side surface 3 c and a film portion 21 b disposed oneach side surface 3 a. In the present embodiment, the film portion 21 aand the film portion 21 b are integrally formed. The insulating film 21is made of, for example, a resin having an electrical insulatingproperty. The resin constituted the insulating film 21 includes, forexample, an acrylic resin, a polyurethane resin, an epoxy resin, or apolyolefin resin. The insulating film 21 does not include a fillerhaving electrical conductivity.

As illustrated in FIG. 4, the film portion 21 a is disposed on the sidesurface 3 c to be along an edge E2 c _(e) of the second electrode layerE2 included in the electrode portion 5 c. FIG. 4 is a view illustratinga second electrode layer and an insulating film.

The film portion 21 a is disposed on the side surface 3 c tocontinuously cover the edge E2 c _(e) and a region exposed from theexternal electrode 5 on the side surface 3 c. In the present embodiment,the film portion 21 a is in direct contact with the second electrodelayer E2 and the side surface 3 c. The film portion 21 a is disposed todirectly cover the edge E2 c _(e) and the side surface 3 c. On the sidesurface 3 c, the film portion 21 a extends along the edge E2 c _(e). Inthe electrode portion 5 c, the film portion 21 a covers a part of thesecond electrode layer E2 and the part of the second electrode layer E2covered with the film portion 21 a includes the edge E2 c _(e). Thethird electrode layer E3 of the electrode portion 5 c is formed in aregion of the second electrode layer E2 that is exposed from the filmportion 21 a.

As illustrated in FIG. 3, a width W1 of the film portion 21 a is 5% ormore of a width W2 of the external electrode 5. The width W1 is thelength of the film portion 21 a in the first direction D1. The width W2of the external electrode 5 is the length of the external electrode 5 inthe first direction D1.

As illustrated in FIG. 5, the film portion 21 b is disposed on the sidesurface 3 a to be along an edge E2 a _(e) of the second electrode layerE2 included in the electrode portion 5 a. FIG. 5 is a view illustratinga second electrode layer and an insulating film.

The film portion 21 b is disposed on the side surface 3 a tocontinuously cover the edge E2 a _(e) and a region exposed from theexternal electrode 5 on the side surface 3 a. In the present embodiment,the film portion 21 b is in direct contact with the second electrodelayer E2 and the side surface 3 a. The film portion 21 b is disposed todirectly cover the edge E2 a _(e) and the side surface 3 a. On the sidesurface 3 a, the film portion 21 b extends along the edge E2 a _(e). Inthe electrode portion 5 a, the film portion 21 b covers a part of thesecond electrode layer E2 and the part of the second electrode layer E2covered with the film portion 21 b includes the edge E2 a _(e). Thethird electrode layer E3 of the electrode portion 5 a is formed in aregion of the second electrode layer E2 that is exposed from the filmportion 21 b.

As illustrated in FIG. 2, a width W3 of the film portion 21 b is 5% ormore of the width W2. The width W3 is the length of the film portion 21b in the first direction D1. The width W3 may be the same as the widthW1 or may be different from the width W1.

When the multilayer capacitor C1 is solder-mounted on an electronicdevice, an external force acting on the multilayer capacitor C1 from theelectronic device may act on the element body 3 through the electrodeportion 5 c. The external force is transmitted to the electrode portion5 c from the solder fillet formed in solder-mounting. The electronicdevice includes, for example, a circuit board or an electroniccomponent.

In the multilayer capacitor C1, the electrode portion 5 c includes thesecond electrode layer E2. Therefore, the external force tends not toact on the element body 3 from the electrode portion 5 c. Consequently,the multilayer capacitor C1 controls occurrence of cracks in the elementbody 3.

The external force acting on the multilayer capacitor C1 from theelectronic device may act on the element body 3 through the electrodeportion 5 a.

In the multilayer capacitor C1, the electrode portion 5 a includes thesecond electrode layer E2. Therefore, the external force tends not toact on the element body 3 from the electrode portion 5 a. Consequently,the multilayer capacitor C1 further controls the occurrence of cracks inthe element body 3.

In the multilayer capacitor C1, the film portion 21 a covers the edge E2c _(e) of the second electrode layer E2 included in the electrodeportion 5 c. Therefore, metal ions tend not to migrate from the secondelectrode layer E2 of the electrode portion 5 c even in a case where themetal ions are generated in the second electrode layer E2 of theelectrode portion 5 c due to an electric field generated between theinternal electrodes 7 and the second electrode layer E2 of the electrodeportion 5 c not electrically connected to the internal electrodes 7 oran electric field generated between the internal electrodes 9 and thesecond electrode layer E2 of the electrode portion 5 c not electricallyconnected to the internal electrodes 9. The film portion 21 a regulatesmigration of the metal ions. Consequently, the multilayer capacitor C1controls occurrence of the migration.

In the multilayer capacitor C1, the film portion 21 b covers the edge E2a _(e) of the second electrode layer E2 included in the electrodeportion 5 a. Therefore, metal ions tend not to migrate from the secondelectrode layer E2 of the electrode portion 5 a even in a case where themetal ions are generated in the second electrode layer E2 of theelectrode portion 5 a due to an electric field generated between theinternal electrode 7A and the second electrode layer E2 of the electrodeportion 5 a not electrically connected to the internal electrode 7A oran electric field generated between the internal electrode 9A and thesecond electrode layer E2 of the electrode portion 5 a not electricallyconnected to the internal electrode 9A. The film portion 21 b regulatesmigration of the metal ions. Consequently, the multilayer capacitor C1further controls the occurrence of the migration.

The second electrode layer E2 includes the plurality of silverparticles. Silver particles tend to cause migration as compared with,for example, copper particles.

The multilayer capacitor C1 reliably controls the occurrence of themigration even when the second electrode layer E2 includes the pluralityof silver particles.

Next, a mounting structure of the multilayer capacitor C1 will bedescribed with reference to FIG. 6. FIG. 6 is a view illustrating themounting structure of a multilayer capacitor according to the presentembodiment.

As illustrated in FIG. 6, an electronic component device includes themultilayer capacitor C1 and an electronic device ED. The electronicdevice ED includes, for example, a circuit board or an electroniccomponent. The multilayer capacitor C1 is solder-mounted on theelectronic device ED. The electronic device ED includes a principalsurface EDa and two pad electrodes PE. Each pad electrode PE is disposedon the principal surface EDa. The two pad electrodes PE are separatedfrom each other. The multilayer capacitor C1 is disposed on theelectronic device ED in such a manner that the side surface 3 a arrangedto constitute the mounting surface and the principal surface EDa opposeeach other. Each of the internal electrodes 7 and 9 is located in aplane approximately parallel to the principal surface EDa. When the sidesurface 3 c is arranged to constitute the mounting surface, each of theinternal electrodes 7 and 9 is located in a plane approximatelyorthogonal to the principal surface EDa.

In solder-mounting the multilayer capacitor C1, the molten solder wetsthe external electrode 5 (third electrode layer E3). Solidification ofthe wet solder causes a solder fillet SF to be formed on the externalelectrode 5. The external electrodes 5 and the pad electrodes PEcorresponding to each other are connected to each other through thesolder fillet SF.

Next, a configuration of a multilayer capacitor C1 ₁ according to amodification of the first embodiment will be described with reference toFIG. 7. FIG. 7 is a view illustrating a cross-sectional configuration ofa multilayer capacitor according to the modification of the firstembodiment. The multilayer capacitor C1 ₁ according to this modificationis generally similar to or the same as the multilayer capacitor C1described above. However, this modification is different from theabove-described first embodiment in the configuration of the electrodeportion 5 e. Hereinafter, differences between the above-described firstembodiment and this modification will be mainly described.

Each electrode portion 5 e includes a first electrode layer E1, a secondelectrode layer E2, and a third electrode layer E3.

The second electrode layer E2 of the electrode portion 5 e is disposedon the first electrode layer E1. In the electrode portion 5 e, thesecond electrode layer E2 is formed to cover the entire first electrodelayer E1. In the electrode portion 5 e, the second electrode layer E2 isin direct contact with the first electrode layer E1. In the electrodeportion 5 e, the second electrode layer E2 indirectly covers the endsurface 3 e in such a manner that the first electrode layer E1 islocated between the second electrode layer E2 and the end surface 3 e.The second electrode layer E2 of the electrode portion 5 e is located onthe end surface 3 e.

The third electrode layer E3 of the electrode portion 5 e is disposed onthe second electrode layer E2. In the electrode portion 5 e, the thirdelectrode layer E3 covers the entire second electrode layer E2. In theelectrode portion 5 e, the third electrode layer E3 is in contact withthe entire second electrode layer E2. In the electrode portion 5 e, thethird electrode layer E3 is in direct contact with the second electrodelayer E2. In the electrode portion 5 e, the third electrode layer E3 isnot in direct contact with the first electrode layer E1. The secondelectrode layer E2 included in each of the electrode portions 5 a, 5 c,and 5 e is integrally formed.

The configuration in which the electrode portion 5 e includes the secondelectrode layer E2 reduces stress acting on the solder fillet formed onthe electrode portion 5 e. Therefore, the multilayer capacitor C1 ₁controls occurrence of solder cracks.

Next, a configuration of a multilayer capacitor C1 ₂ according to amodification of the first embodiment will be described with reference toFIG. 8. FIG. 8 is a view illustrating a cross-sectional configuration ofa multilayer capacitor according to the modification of the firstembodiment. The multilayer capacitor C1 ₂ according to this modificationis generally similar to or the same as the multilayer capacitor C1described above. However, this modification is different from theabove-described first embodiment in the configuration of the electrodeportion 5 a and the insulating film 21. Hereinafter, differences betweenthe above-described first embodiment and this modification will bemainly described.

As illustrated in FIG. 8, the electrode portion 5 a may not include thesecond electrode layer E2.

The third electrode layer E3 of the electrode portion 5 a is disposed onthe first electrode layer E1. In the electrode portion 5 a, the thirdelectrode layer E3 covers the entire first electrode layer E1. In theelectrode portion 5 a, the third electrode layer E3 is in contact withthe entire first electrode layer E1. In the electrode portion 5 a, thethird electrode layer E3 is in direct contact with the first electrodelayer E1. The third electrode layer E3 of the electrode portion 5 a islocated on the side surface 3 a.

In the configuration in which the electrode portion 5 a does not includethe second electrode layer E2, the second electrode layer E2 and theinternal electrode 7 that are not electrically connected to each otherdo not oppose each other in the second direction D2, and the secondelectrode layer E2 and the internal electrode 9 that are notelectrically connected to each other do not oppose each other in thesecond direction D2. Therefore, the insulating film 21 may not includethe film portion 21 b. Even when the insulating film 21 does not includethe film portion 21 b, the multilayer capacitor C1 ₂ further controlsthe occurrence of the migration.

In the configuration in which the electrode portion 5 a does not includethe second electrode layer E2, the insulating film 21 may not includethe film portion 21 b as illustrated in FIG. 8. Even in theconfiguration in which the insulating film 21 does not include the filmportion 21 b, the insulating film 21 includes the film portion 21 a asin the multilayer capacitor C1 illustrated in FIG. 3.

Next, a configuration of a multilayer capacitor C1 ₃ according to amodification of the first embodiment will be described with reference toFIGS. 9 to 11. FIGS. 9, 10, and 11 are views illustrating across-sectional configuration of a multilayer capacitor according to themodification of the first embodiment. The multilayer capacitor C1 ₃according to this modification is generally similar to or the same asthe multilayer capacitor C1 described above. However, this modificationis different from the above-described first embodiment in theconfiguration of the internal electrodes 7A and 9A and the insulatingfilm 21. Hereinafter, differences between the above-described firstembodiment and this modification will be mainly described.

The internal electrode 7A includes a pair of ends 7Ae₁ and 7Ae₂ opposingeach other in the first direction D1, as illustrated in FIGS. 9 and 10.The end 7Ae₁ is exposed to the end surface 3 e. The end 7Ae₂ is locatedwithin the element body 3. The internal electrode 9A includes a pair ofends 9Ae₁ and 9Ae₂ opposing each other in the first direction D1, asillustrated in FIGS. 9 and 11. The end 9Ae₁ is exposed to the endsurface 3 e. The end 9Ae₂ is located within the element body 3. Forexample, when each of the ends 7Ae₁ and 9Ae₁ constitutes a first end,each of the ends 7Ae₂ and 9Ae₂ constitutes a second end.

The second electrode layer E2 of the electrode portion 5 a is located onthe side surface 3 a. Each second electrode layer E2 located on the sameside surface 3 a includes an edge E2 a _(e). On the same side surface 3a, the edge E2 a _(e) of one second electrode layer E2 opposes the edgeE2 a _(e) of the other second electrode layer E2.

As illustrated in FIG. 9, a length L1 ₁ is larger than a length L2 ₁.The length L1 ₁ is the length of the internal electrode 7A in the firstdirection D1 from a reference plane PL1. The length L2 ₁ is a length inthe first direction D1 from the reference plane PL1 to the edge E2 a_(e) of the second electrode layer E2 electrically connected to theinternal electrode 7A. Therefore, when the internal electrode 7A and thesecond electrode layer E2 electrically connected to the internalelectrode 7A are viewed from the second direction D2, the end 7Ae₂ isexposed from the second electrode layer E2 electrically connected to theinternal electrode 7A.

The length L1 ₁ is smaller than a length L3 ₁. The length L3 ₁ is alength in the first direction D1 from the reference plane PL1 to theedge E2 a _(e) of the second electrode layer E2 not electricallyconnected the internal electrode 7A. Therefore, when the internalelectrode 7A and the second electrode layer E2 not electricallyconnected the internal electrode 7A are viewed from the second directionD2, the internal electrode 7A and the second electrode layer E2 notelectrically connected the internal electrode 7A does not overlap eachother.

The reference plane PL1 includes the end surface 3 e to which the end7Ae₁ of the internal electrode 7A is exposed. For example, when thelength L1 ₁ constitutes a first length, the length L2 ₁ constitutes asecond length and the length L3 ₁ constitutes a third length.

A length L1 ₂ is larger than a length L2 ₂. The length L1 ₂ is thelength of the internal electrode 9A in the first direction D1 from areference plane PL2. The length L2 ₂ is a length in the first directionD1 from the reference plane PL2 to the edge E2 a _(e) of the secondelectrode layer E2 electrically connected to the internal electrode 9A.Therefore, when the internal electrode 9A and the second electrode layerE2 electrically connected to the internal electrode 9A are viewed fromthe second direction D2, the end 9Ae₂ is exposed from the secondelectrode layer E2 electrically connected to the internal electrode 9A.

The length L1 ₂ is smaller than a length L32. The length L32 is a lengthin the first direction D1 from the reference plane PL2 to the edge E2 a_(e) of the second electrode layer E2 not electrically connected to theinternal electrode 9A. Therefore, when the internal electrode 9A and thesecond electrode layer E2 not electrically connected to the internalelectrode 9A are viewed from the second direction D2, the internalelectrode 9A and the second electrode layer E2 not electricallyconnected to the internal electrode 9A does not overlap each other.

The reference plane PL2 includes the end surface 3 e to which the end9Ae₁ of the internal electrode 9A is exposed. For example, when thelength L1 ₂ constitutes a first length, the length L2 ₂ constitutes asecond length and the length L32 constitutes a third length.

A length L4 ₁ is smaller than the length L2 ₁. The length L4 ₁ is alength in the first direction D1 from the reference plane PL1 to theother end of the internal electrode 9. Therefore, when the internalelectrode 9 not electrically connected to the internal electrode 7A andthe second electrode layer E2 to which the internal electrode 7A iselectrically connected are viewed from the second direction D2, theinternal electrode 9 and the second electrode layer E2 to which theinternal electrode 7A is electrically connected overlap each other.

A length L4 ₂ is smaller than the length L2 ₂. The length L4 ₂ is alength in the first direction D1 from the reference plane PL2 to theother end of the internal electrode 7. Therefore, when the internalelectrode 7 not electrically connected to the internal electrode 9A andthe second electrode layer E2 electrically connected to the internalelectrode 9A are viewed from the second direction D2, the internalelectrode 7 and the second electrode layer E2 electrically connected tothe internal electrode 9A overlap each other.

The length L1 ₁ and the length L1 ₂ may be equal or different. Thelength L2 ₁ and the length L2 ₂ may be equal or different. The length L3₁ and the length L3 ₂ may be equal or different. The length L4 ₁ and thelength L4 ₂ may be equal or different.

The multilayer capacitor C1 ₃ includes a plurality of conductors 11 and13. The multilayer capacitor C1 ₃ includes two conductors 11 and 13. InFIGS. 10 and 11, for the sake of explanation, the internal electrodes 7and 9 (internal electrodes 7A and 9A) and the conductors 11 and 13 areintentionally illustrated so as to deviate from each other in the thirddirection D3. Each of conductors 11 and 13 constitutes an electricalconductor.

The conductor 11 is located in the same layer as the internal electrode7A and is separated from the internal electrode 7A. The conductor 11includes one end exposed to the corresponding end surface 3 e. The oneend of the conductor 11 is exposed to the end surface 3 e to which oneend of the internal electrode 9 is exposed. The one end of the conductor11 is completely covered with the corresponding electrode portion 5 e.The conductor 11 is directly connected to the corresponding electrodeportion 5 e. The conductor 11 is electrically connected to thecorresponding external electrode 5. In the multilayer capacitor C1 ₃,the conductor 11 is electrically connected to the external electrode 5(electrode portion 5 e) electrically connected to the internal electrode9. The conductor 11 is electrically connected to the external electrode5 not electrically connected to the internal electrode 7.

The conductor 13 is located in the same layer as the internal electrode9A and is separated from the internal electrode 9A. The conductor 13includes one end exposed to the corresponding end surface 3 e. The oneend of the conductor 13 is exposed to the end surface 3 e to which oneend of the internal electrode 7 is exposed. The one end of the conductor13 is completely covered with the corresponding electrode portion 5 e.The conductor 13 is directly connected to the corresponding electrodeportion 5 e. The conductor 13 is electrically connected to thecorresponding external electrode 5. In the multilayer capacitor C1 ₃,the conductor 13 is electrically connected to the external electrode 5(electrode portion 5 e) electrically connected to the internal electrode7. The conductor 13 is electrically connected to the external electrode5 not electrically connected to the internal electrode 9.

The conductors 11 and 13 constitute dummy conductors that tend not tocontribute to generation of capacitance.

In the multilayer capacitor C1 ₃, the lengths L1 ₁ and L1 ₂ are largerthan the lengths L2 ₁ and L2 ₂. Therefore, the internal electrode 9adjacent to the internal electrode 7A in the second direction D2 and thesecond electrode layer E2 included in the electrode portion 5 a adjacentto the internal electrode 7A in the second direction D2 are notelectrically connected to each other, but tend not to oppose each otherin the second direction D2. The internal electrode 7 adjacent to theinternal electrode 9A in the second direction D2 and the secondelectrode layer E2 included in the electrode portion 5 a adjacent to theinternal electrode 9A in the second direction D2 are not electricallyconnected to each other, but tend not to oppose each other in the seconddirection D2. An electric field tends not to be generated between thesecond electrode layer E2 and the internal electrode 7 that are notelectrically connected to each other, and between the second electrodelayer E2 and the internal electrode 9 that are not electricallyconnected to each other.

The lengths L1 ₁ and L1 ₂ are smaller than the lengths L3 ₁ and L3 ₂.Therefore, the internal electrode 7A tends not to oppose the secondelectrode layer E2 included in the electrode portion 5 a notelectrically connected to the internal electrode 7A, in the seconddirection D2, and the internal electrode 9A tends not to oppose thesecond electrode layer E2 included in the electrode portion 5 a notelectrically connected to the internal electrode 9A, in the seconddirection D2. An electric field tends not to be generated between thesecond electrode layer E2 and the internal electrode 7A that are notelectrically connected to each other, and between the second electrodelayer E2 and the internal electrode 9A that are not electricallyconnected to each other.

Consequently, the multilayer capacitor C1 ₃ further controls theoccurrence of the migration. Therefore, the insulating film 21 may notinclude the film portion 21 b.

In the multilayer capacitor C1 ₃, the conductor 11 is electricallyconnected to the external electrode 5 not electrically connected to theinternal electrode 7A. The conductor 13 is electrically connected to theexternal electrode 5 not electrically connected to the internalelectrode 9A.

In the configuration in which the conductor 11 is located in the samelayer as the internal electrode 7A and the conductor 13 is located inthe same layer as the internal electrode 9A, structural defects tend notto occur in the element body 3.

Next, a configuration of a multilayer capacitor C1 ₄ according to amodification of the first embodiment will be described with reference toFIGS. 12 to 14. FIGS. 12, 13, and 14 are views illustrating across-sectional configuration of a multilayer capacitor according to themodification of the first embodiment. The multilayer capacitor C1 ₄according to this modification is generally similar to or the same asthe multilayer capacitor C1 ₃ illustrated in FIGS. 9 to 11. However,this modification is different from the multilayer capacitor C1 ₃ in theconfiguration of the conductors 11 and 13. Hereinafter, differencesbetween the multilayer capacitor C1 ₃ and this modification will bemainly described.

The multilayer capacitor C1 ₄ includes a pair of conductors 11 and 13.In FIGS. 13 and 14, for the sake of explanation, the internal electrodes7A and 9A and the conductors 11 and 13 are intentionally illustrated soas to deviate from each other in the third direction D3. Even in themultilayer capacitor C1 ₄, the conductors 11 and 13 constitute dummyconductors that tend not to contribute to generation of capacitance.Each of conductors 11 and 13 constitutes an electrical conductor.

The conductor 11 is adjacent to one side surface 3 a in the seconddirection D2. The conductor 11 is adjacent to the internal electrode 9Ain the second direction D2. The conductor 11 is located between the oneside surface 3 a and the internal electrode 9A. The conductor 11includes a portion 11 a and a portion 11 b.

The portion 11 a opposes the second electrode layer E2 in the seconddirection D2. The second electrode layer E2 opposing the portion 11 a isnot electrically connected to the internal electrode 9A and is disposedon the one side surface 3 a. Therefore, the conductor 11 opposes thesecond electrode layer E2 not electrically connected to the internalelectrode 9A, in the second direction D2.

The portion 11 b opposes the second electrode layer E2 in the seconddirection D2. The second electrode layer E2 opposing the portion 11 b iselectrically connected to the internal electrode 9A and is disposed onthe one side surface 3 a.

For example, when the portion 11 a constitutes a first portion, theportion 11 b constitutes a second portion.

The portion 11 a is separated from the portion 11 b in the firstdirection D1 and is not electrically connected to any second electrodelayer E2. The portion 11 a includes no end exposed to the surface of theelement body 3.

The portion 11 b is electrically connected to the second electrode layerE2 opposing the portion 11 b in the second direction D2. The portion 11b includes an end exposed to the end surface 3 e to which the internalelectrode 9A is exposed. The portion 11 b is directly connected to theexternal electrode 5 (electrode portion 5 e) electrically connected tothe internal electrode 9A, at the end exposed to the end surface 3 e.The portion 11 b is electrically connected to the external electrode 5to which the internal electrode 9A is electrically connected.

The conductor 13 is adjacent to the other side surface 3 a in the seconddirection D2. The conductor 13 is adjacent to the internal electrode 7Ain the second direction D2. The conductor 13 is located between theother side surface 3 a and the internal electrode 7A. The conductor 13includes a portion 13 a and a portion 13 b.

The portion 13 a opposes the second electrode layer E2 in the seconddirection D2. The second electrode layer E2 opposing the portion 13 a isnot electrically connected to the internal electrode 7A and is disposedon the other side surface 3 a. Therefore, the conductor 13 opposes thesecond electrode layer E2 not electrically connected to the internalelectrode 7A, in the second direction D2.

The portion 13 b opposes the second electrode layer E2 in the seconddirection D2. The second electrode layer E2 opposing the portion 13 b iselectrically connected to the internal electrode 7A and is disposed onthe other side surface 3 a.

The portion 13 a is separated from the portion 13 b in the firstdirection D1 and is not electrically connected to any second electrodelayer E2. The portion 13 a includes no end exposed to the surface of theelement body 3.

The portion 13 b is electrically connected to the second electrode layerE2 opposing the portion 13 b in the second direction D2. The portion 13b includes an end exposed to the end surface 3 e to which the internalelectrode 7A is exposed. The portion 13 b is directly connected to theexternal electrode 5 (electrode portion 5 e) electrically connected tothe internal electrode 7A, at the end exposed to the end surface 3 e.The portion 13 b is electrically connected to the external electrode 5to which the internal electrode 7A is electrically connected.

For example, when the portion 13 a constitutes a first portion, theportion 13 b constitutes a second portion.

The end 7Ae₂ overlaps the conductor 13 (portion 13 a) when viewed fromthe second direction D2. In the positional relationship between theinternal electrode 9A, the second electrode layer E2 not electricallyconnected to the internal electrode 9A and disposed on the one sidesurface 3 a, and the conductor 13 (portion 13 a), the conductor 13(portion 13 a) is located between the internal electrode 9A and thesecond electrode layer E2. Therefore, in the above-described positionalrelationship, the internal electrode 9A and the second electrode layerE2 not electrically connected to the internal electrode 9A and disposedon the one side surface 3 a do not oppose each other in the seconddirection D2.

The end 9Ae₂ overlaps the conductor 11 (portion 11 a) when viewed fromthe second direction D2. In the positional relationship between theinternal electrode 7A, the second electrode layer E2 not electricallyconnected to the internal electrode 7A and disposed on the other sidesurface 3 a, and the conductor 11 (portion 11 a), the conductor 11(portion 11 a) is located between the internal electrode 7A and thesecond electrode layer E2. Therefore, in the above-described positionalrelationship, the internal electrode 7A and the second electrode layerE2 not electrically connected to the internal electrode 7A and disposedon the other side surface 3 a do not oppose each other in the seconddirection D2.

In the multilayer capacitor C1 ₄, the conductor 11 is located betweenthe second electrode layer E2 and the internal electrode 7A that is notelectrically connected to the second electrode layer E2. Due to theconductor 11, the second electrode layer E2 is separated from theinternal electrode 7A that is not electrically connected to the secondelectrode layer E2. Therefore, an electric field tends not to begenerated between the second electrode layer E2 and the internalelectrode 7A that is not electrically connected to the second electrodelayer E2. Even in a case where an electric field is generated betweenthe second electrode layer E2 and the internal electrode 7A that is notelectrically connected to the second electrode layer E2, strength of theelectric field is small.

The conductor 13 is located between the second electrode layer E2 andthe internal electrode 9A that is not electrically connected to thesecond electrode layer E2. Due to the conductor 13, the second electrodelayer E2 is separated from the internal electrode 9A that is notelectrically connected to the second electrode layer E2. Therefore, anelectric field tends not to be generated between the second electrodelayer E2 and the internal electrode 9A that is not electricallyconnected to the second electrode layer E2. Even in a case where anelectric field is generated between the second electrode layer E2 andthe internal electrode 9A that is not electrically connected to thesecond electrode layer E2, strength of the electric field is small.

Consequently, the multilayer capacitor C1 ₄ further controls theoccurrence of the migration. Therefore, the insulating film 21 may notinclude the film portion 21 b.

In the multilayer capacitor C1 ₄, the conductor 11 includes the portion11 a and the portion 11 b, and the conductor 13 includes the portion 13a and the portion 13 b.

The portion 11 a opposes the second electrode layer E2 not electricallyconnected to the internal electrode 9A adjacent to the conductor 11 inthe second direction D2, in the second direction D2. The portion 11 bopposes the second electrode layer E2 electrically connected to theinternal electrode 9A, in the second direction D2.

The portion 13 a opposes the second electrode layer E2 not electricallyconnected to the internal electrode 7A adjacent to the conductor 13 inthe second direction D2, in the second direction D2. The portion 13 bopposes the second electrode layer E2 electrically connected to theinternal electrode 7A, in the second direction D2.

In the multilayer capacitor C1 ₄, the configuration on the one endsurface 3 e side from the center in the first direction D1 and theconfiguration on the other end surface 3 e side from the center in thefirst direction D1 tend not to be different from each other. Therefore,structural defects tend not to occur in the element body 3.

In the multilayer capacitor C1 ₄, the end 7Ae₂ overlaps the conductor 13(portion 13 a) when viewed from the second direction D2. Therefore, anelectric field further tends not to be generated between the secondelectrode layer E2 and the internal electrode 7A that is notelectrically connected to the second electrode layer E2. The end 9Ae₂overlaps the conductor 11 (portion 11 a) when viewed from the seconddirection D2. Therefore, an electric field further tends not to begenerated between the second electrode layer E2 and the internalelectrode 9A that is not electrically connected to the second electrodelayer E2. Consequently, the multilayer capacitor C1 ₄ further controlsthe occurrence of the migration.

Next, a configuration of a multilayer capacitor C1 ₅ according to amodification of the first embodiment will be described with reference toFIGS. 15 to 17. FIGS. 15, 16, and 17 are views illustrating across-sectional configuration of a multilayer capacitor according to themodification of the first embodiment. The multilayer capacitor C1 ₅according to this modification is generally similar to or the same asthe multilayer capacitor C1 ₄ illustrated in FIGS. 12 to 14. However,this modification is different from the multilayer capacitor C1 ₄ in theconfiguration of the conductors 11 and 13. Hereinafter, differencesbetween the multilayer capacitor C1 ₄ and this modification will bemainly described.

In the multilayer capacitor C1 ₅, the portion 11 a and the portion 11 bare integrated. The conductor 11 includes no end exposed to the surfaceof the element body 3. The conductor 11 is not connected to any of theexternal electrodes 5. The conductor 11 is not electrically connected tothe second electrode layer E2.

The portion 13 a and the portion 13 b are integrated. The conductor 13includes no end exposed to the surface of the element body 3. Theconductor 13 is not connected to any of the external electrodes 5. Theconductor 13 is not electrically connected to the second electrode layerE2.

The end 7Ae₂ opposes the second electrode layer E2 not electricallyconnected to the internal electrode 7A and disposed on the other sidesurface 3 a, in the second direction D2. The end 7Ae₂ is exposed fromthe conductor 13 (portion 13 a) when viewed from the second directionD2.

The end 9Ae₂ opposes the second electrode layer E2 not electricallyconnected to the internal electrode 9A and disposed on the one sidesurface 3 a, in the second direction D2. The end 9Ae₂ is exposed fromthe conductor 11 (portion 11 a) when viewed from the second directionD2.

In the multilayer capacitor C1 ₅, the lengths of the internal electrodes7 and 9 in the second direction D2 increase, and then capacitance of themultilayer capacitor can be increased.

Next, a configuration of a multilayer capacitor C1 ₆ according to amodification of the first embodiment will be described with reference toFIGS. 18 and 19. FIGS. 18 and 19 are views illustrating across-sectional configuration of a multilayer capacitor according to themodification of the first embodiment. The multilayer capacitor C1 ₆according to this modification is generally similar to or the same asthe multilayer capacitor C1 described above. However, this modificationis different from the above-described first embodiment in theconfiguration of the electrode portions 5 a and 5 c and the insulatingfilm 21. Hereinafter, differences between the above-described firstembodiment and this modification will be mainly described.

In the multilayer capacitor C1 ₆, the film portion 21 a is in directcontact with the third electrode layer E3 and the side surface 3 c. Thefilm portion 21 a is disposed to indirectly cover the edge E2 c _(e) anddirectly cover the side surface 3 c. In the electrode portion 5 c, thefilm portion 21 a indirectly covers a part of the second electrode layerE2. The part of the second electrode layer E2 indirectly covered withthe film portion 21 a includes the edge E2 c _(e).

The film portion 21 b is in direct contact with the third electrodelayer E3 and the side surface 3 a. The film portion 21 b is disposed toindirectly cover the edge E2 a _(e) and directly cover the side surface3 a. In the electrode portion 5 a, the film portion 21 b indirectlycovers a part of the second electrode layer E2. The part of the secondelectrode layer E2 indirectly covered with the film portion 21 bincludes the edge E2 a _(e).

In the multilayer capacitor C1 ₆, the second electrode layer E2 of theelectrode portion 5 a is formed to cover the entire first electrodelayer E1 of the electrode portion 5 a. The second electrode layer E2 ofthe electrode portion 5 c is formed to cover the entire first electrodelayer E1 of the electrode portion 5 c.

Even in the multilayer capacitor C1 ₆, metal ions tend not to migratefrom the second electrode layer E2 of the electrode portion 5 c even ina case where the metal ions are generated in the second electrode layerE2 of the electrode portion 5 c due to an electric field generatedbetween the internal electrodes 7 and the second electrode layer E2 ofthe electrode portion 5 c not electrically connected to the internalelectrodes 7 or an electric field generated between the internalelectrodes 9 and the second electrode layer E2 of the electrode portion5 c not electrically connected to the internal electrodes 9. The filmportion 21 a regulates migration of the metal ions. Consequently, themultilayer capacitor C1 ₆ controls the occurrence of the migration.

Metal ions tend not to migrate from the second electrode layer E2 of theelectrode portion 5 a even in a case where the metal ions are generatedin the second electrode layer E2 of the electrode portion 5 a due to anelectric field generated between the internal electrode 7A and thesecond electrode layer E2 of the electrode portion 5 a not electricallyconnected to the internal electrode 7A or an electric field generatedbetween the internal electrode 9A and the second electrode layer E2 ofthe electrode portion 5 a not electrically connected to the internalelectrode 9A. The film portion 21 b regulates migration of the metalions. Consequently, the multilayer capacitor C1 ₆ further controls theoccurrence of the migration.

Second Embodiment

A configuration of a multilayer capacitor C2 according to a secondembodiment will be described with reference to FIGS. 20 to 22. FIG. 20is a perspective view of the multilayer capacitor according to thesecond embodiment. FIGS. 21 and 22 are views illustrating across-sectional configuration of the multilayer capacitor according tothe second embodiment. The multilayer capacitor C2 is generally similarto or the same as the multilayer capacitor C1. However, the multilayercapacitor C2 is different from the multilayer capacitor C1 in theconfiguration of the second electrode layer E2. The multilayer capacitorC2 is different from the multilayer capacitor C1 in that the insulatingfilm 21 is not provided. Hereinafter, differences between the multilayercapacitor C1 and the multilayer capacitor C2 will be mainly described.Also in the present embodiment, an electronic component includes, forexample, the multilayer capacitor C2.

As illustrated in FIGS. 20 to 22, the multilayer capacitor C2 includesan element body 3, a plurality of external electrodes 5, a plurality ofinternal electrodes 7, and a plurality of internal electrodes 9. Themultilayer capacitor C2 does not include the insulating film 21 includedin the multilayer capacitor C1. In the present embodiment, themultilayer capacitor C2 includes a pair of external electrodes 5.

The external electrode 5 includes a plurality of electrode portions 5 a,5 c, and 5 e. Each of the electrode portions 5 a and 5 c includes afirst electrode layer E1, a second electrode layer E2, and a thirdelectrode layer E3. Each electrode portion 5 e includes the firstelectrode layer E1 and the third electrode layer E3.

The second electrode layer E2 of the electrode portion 5 c is located onthe side surface 3 c. Each second electrode layer E2 located on the sameside surface 3 c includes an edge E2 c _(e). On the same side surface 3c, the edge E2 c _(e) of one second electrode layer E2 opposes the edgeE2 c _(e) of the other second electrode layer E2.

In the electrode portion 5 c, each second electrode layer E2 includes aregion E2 c ₁ and a region E2 c ₂. The region E2 c ₂ is located closerto the edge E2 c _(e) than the region E2 c ₁, and includes the edge E2 c_(e). A content of the metal particles in the region E2 c ₂ is smallerthan a content of the metal particles in the region E2 c ₁. The contentof the metal particles in the region E2 c ₂ is, for example, less than30 vol %. The content of the metal particles in the region E2 c ₁ is,for example, 30 vol % or more. In the present embodiment, the content ofthe metal particles in the region E2 c ₂ is about 25 vol %, and thecontent of the metal particles in the region E2 c ₁ is about 50 vol %.

The second electrode layer E2 of the electrode portion 5 a is located onthe side surface 3 a. Each second electrode layer E2 located on the sameside surface 3 a includes an edge E2 a _(e). On the same side surface 3a, the edge E2 a _(e) of one second electrode layer E2 opposes the edgeE2 a _(e) of the other second electrode layer E2.

In the electrode portion 5 a, each second electrode layer E2 includes aregion E2 a ₁ and a region E2 a ₂. The region E2 a ₂ is located closerto the edge E2 a _(e) than the region E2 a ₁, and includes the edge E2 a_(e). A content of the metal particles in the region E2 a ₂ is smallerthan a content of the metal particles in the region E2 a ₁. The contentof the metal particles in the region E2 a ₂ is, for example, less than30 vol %. The content of the metal particles in the region E2 a ₁ is,for example, 30 vol % or more. In the present embodiment, the content ofthe metal particles in the region E2 a ₂ is about 25 vol %, and thecontent of the metal particles in the region E2 a ₁ is about 50 vol %.

For example, when the region E2 c ₁ constitutes a first region, theregion E2 c ₂ constitutes a second region, the region E2 a ₁ constitutesa third region, and the region E2 a ₂ constitutes a fourth region. Forexample, when the content of the metal particles in the region E2 c ₁ isa first content, the content of the metal particles in the region E2 c ₂is a second content, the content of the metal particles in the region E2a ₁ is a third content, and the content of the metal particles in theregion E2 a ₂ is a fourth content.

A width W4 of the region E2 c ₂ is 5% or more of the width W2, asillustrated in FIG. 21. The width W4 is the length of the region E2 c ₂in the first direction D1.

A width W5 of the region E2 a ₂ is 5% or more of the width W2, asillustrated in FIG. 22. The width W5 is the length of the region E2 a ₂in the first direction D1. The width W5 may be the same as the width W4or may be different from the width W4.

In the multilayer capacitor C2, the electrode portion 5 c includes thesecond electrode layer E2. Therefore, the multilayer capacitor C2controls occurrence of cracks in the element body 3 in the same manneras the multilayer capacitor C1.

In the multilayer capacitor C2, the electrode portion 5 a includes thesecond electrode layer E2. Therefore, the multilayer capacitor C2further controls the occurrence of cracks in the element body 3 in thesame manner as the multilayer capacitor C1.

In the multilayer capacitor C2, the region E2 c ₂ constitutes the edgeE2 c _(e) of the second electrode layer E2 included in the electrodeportion 5 c. The content of the metal particles in the region E2 c ₂ issmaller than the content of the metal particles in the region E2 c ₁. Anamount of metal ions generated in the region E2 c ₂ is small, ascompared with that in the region E2 c ₁ even in a case where the metalions are generated in the second electrode layer E2 of the electrodeportion 5 c due to an electric field generated between the internalelectrodes 7 and the second electrode layer E2 of the electrode portion5 c not electrically connected to which the internal electrodes 7 or anelectric field generated between the internal electrodes 9 and thesecond electrode layer E2 of the electrode portion 5 c not electricallyconnected to which the internal electrodes 9. Therefore, in themultilayer capacitor C2, an amount of metal ions migrating from thesecond electrode layer E2 of the electrode portion 5 c is small, ascompared with that in the configuration in which the second electrodelayer E2 of the electrode portion 5 c is the region E2 c ₁.Consequently, the multilayer capacitor C2 controls occurrence ofmigration.

In the multilayer capacitor C2, the region E2 a ₂ constitutes the edgeE2 a _(e) of the second electrode layer E2 included in the electrodeportion 5 a. The content of the metal particles in the region E2 a ₂ issmaller than the content of the metal particles in the region E2 a ₁. Anamount of metal ions generated in the region E2 a ₂ is small, ascompared with that in the region E2 a ₁ even in a case where the metalions are generated in the second electrode layer E2 of the electrodeportion 5 a due to an electric field generated between the internalelectrode 7A and the second electrode layer E2 of the electrode portion5 a not electrically connected to the internal electrode 7A or anelectric field generated between the internal electrode 9A and thesecond electrode layer E2 of the electrode portion 5 a not electricallyconnected to the internal electrode 9A. Therefore, in the multilayercapacitor C2, an amount of metal ions migrating from the secondelectrode layer E2 of the electrode portion 5 a is small, as comparedwith that in the configuration in which the second electrode layer E2 ofthe electrode portion 5 a is the region E2 a ₁. Consequently, themultilayer capacitor C2 further controls the occurrence of themigration.

The second electrode layer E2 includes the plurality of silverparticles. Silver particles tend to cause migration as compared with,for example, copper particles.

The multilayer capacitor C2 reliably controls the occurrence of themigration even when the second electrode layer E2 includes the pluralityof silver particles.

Next, a configuration of a multilayer capacitor C2 ₁ according to amodification of the second embodiment will be described with referenceto FIG. 23. FIG. 23 is a view illustrating a cross-sectionalconfiguration of a multilayer capacitor according to the modification ofthe second embodiment. The multilayer capacitor C2 ₁ according to thismodification is generally similar to or the same as the multilayercapacitor C2 described above. However, this modification is differentfrom the above-described second embodiment in the configuration of theelectrode portion 5 e. Hereinafter, differences between theabove-described second embodiment and this modification will be mainlydescribed. This modification is similar to the multilayer capacitor C1 ₁illustrated in FIG. 7 in the configuration of the electrode portion 5 e.

Each electrode portion 5 e includes a first electrode layer E1, a secondelectrode layer E2, and a third electrode layer E3, as in the multilayercapacitor C1 ₁.

The configuration in which the electrode portion 5 e includes the secondelectrode layer E2 reduces stress acting on the solder fillet formed onthe electrode portion 5 e. Therefore, the multilayer capacitor C2 ₁controls occurrence of solder cracks.

Next, a configuration of a multilayer capacitor C22 according to amodification of the second embodiment will be described with referenceto FIG. 24. FIG. 24 is a view illustrating a cross-sectionalconfiguration of a multilayer capacitor according to the modification ofthe second embodiment. The multilayer capacitor C22 according to thismodification is generally similar to or the same as the multilayercapacitor C2 described above. However, this modification is differentfrom the above-described second embodiment in the configuration of theelectrode portion 5 a. Hereinafter, differences between theabove-described second embodiment and this modification will be mainlydescribed. This modification is similar to the multilayer capacitor C1 ₂illustrated in FIG. 8 in the configuration of the electrode portion 5 a.

The electrode portion 5 a may not include the second electrode layer E2similarly to the electrode portion 5 a of the multilayer capacitor C1 ₂.

In the configuration in which the electrode portion 5 a does not includethe second electrode layer E2, the second electrode layer E2 and theinternal electrode 7 that are not electrically connected to each otherdo not oppose each other in the second direction D2, and the secondelectrode layer E2 and the internal electrode 9 that are notelectrically connected to each other do not oppose each other in thesecond direction D2. Therefore, also the multilayer capacitor C22further controls the occurrence of the migration.

Next, a configuration of a multilayer capacitor C2 ₃ according to amodification of the second embodiment will be described with referenceto FIGS. 25 to 27. FIGS. 25, 26, and 27 are views illustrating across-sectional configuration of a multilayer capacitor according to themodification of the second embodiment. The multilayer capacitor C2 ₃according to this modification is generally similar to or the same asthe multilayer capacitor C2 described above. However, this modificationis different from the above-described second embodiment in theconfiguration of the internal electrodes 7A and 9A. Hereinafter,differences between the above-described second embodiment and thismodification will be mainly described. This modification is similar tothe multilayer capacitor C1 ₃ illustrated in FIGS. 9 to 11 in theconfiguration of the internal electrodes 7A and 9A.

In the multilayer capacitor C2 ₃, the lengths L1 ₁ and L1 ₂ are largerthan the lengths L2 ₁ and L2 ₂, as in the multilayer capacitor C1 ₃. Inthe multilayer capacitor C2 ₃, the length L2 ₁ is a length in the firstdirection D1 from the reference plane PL1 to the edge E2 a _(e) of thesecond electrode layer E2 electrically connected to the internalelectrode 7A, and the length L2 ₂ is a length in the first direction D1from the reference plane PL2 to the edge E2 a _(e) of the secondelectrode layer E2 electrically connected to the internal electrode 9A.Therefore, the internal electrode 9 adjacent to the internal electrode7A in the second direction D2 and the second electrode layer E2 includedin the electrode portion 5 a adjacent to the internal electrode 7A inthe second direction D2 are not electrically connected to each other,but tend not to oppose each other in the second direction D2. Theinternal electrode 7 adjacent to the internal electrode 9A in the seconddirection D2 and the second electrode layer E2 included in the electrodeportion 5 a adjacent to the internal electrode 9A in the seconddirection D2 are not electrically connected to each other, but tend notto oppose each other in the second direction D2. An electric field tendsnot to be generated between the second electrode layer E2 and theinternal electrode 7 that are not electrically connected to each other,and between the second electrode layer E2 and the internal electrode 9that are not electrically connected to each other.

The lengths L1 ₁ and L1 ₂ are smaller than the lengths L3 ₁ and L3 ₂. Inthe multilayer capacitor C2 ₃, the length L3 ₁ is a length in the firstdirection D1 from the reference plane PL1 to the edge E2 a _(e) of thesecond electrode layer E2 to which the internal electrode 7A is notelectrically connected, and the length L3 ₂ is a length in the firstdirection D1 from the reference plane PL2 to the edge E2 a _(e) of thesecond electrode layer E2 to which the internal electrode 9A is notelectrically connected. Therefore, the internal electrode 7A tends notto oppose the second electrode layer E2 included in the electrodeportion 5 a not electrically connected to the internal electrode 7A, inthe second direction D2, and the internal electrode 9A tends not tooppose the second electrode layer E2 included in the electrode portion 5a not electrically connected to the internal electrode 9A, in the seconddirection D2. An electric field tends not to be generated between thesecond electrode layer E2 and the internal electrode 7A that are notelectrically connected to each other, and between the second electrodelayer E2 and the internal electrode 9A that are not electricallyconnected to each other.

Consequently, the multilayer capacitor C2 ₃ further controls theoccurrence of the migration. Therefore, the second electrode layer E2included in the electrode portion 5 a may not include the region E2 a ₂.Although not illustrated, the second electrode layer E2 included in theelectrode portion 5 a may include the region E2 a ₂.

Next, a configuration of a multilayer capacitor C2 ₄ according to amodification of the second embodiment will be described with referenceto FIGS. 28 to 30. FIGS. 28, 29, and 30 are views illustrating across-sectional configuration of a multilayer capacitor according to themodification of the second embodiment. The multilayer capacitor C2 ₄according to this modification is generally similar to or the same asthe multilayer capacitor C2 ₃ illustrated in FIGS. 25 to 27. However,this modification is different from the multilayer capacitor C2 ₃ in theconfiguration of the conductors 11 and 13. Hereinafter, differencesbetween the multilayer capacitor C2 ₃ and this modification will bemainly described. This modification is similar to the multilayercapacitor C1 ₄ illustrated in FIGS. 12 to 14 in the configuration of theconductors 11 and 13.

The multilayer capacitor C2 ₄ includes a pair of conductors 11 and 13similarly to the multilayer capacitor C1 ₄. In FIGS. 29 and 30, for thesake of explanation, the internal electrodes 7A and 9A and theconductors 11 and 13 are intentionally illustrated so as to deviate fromeach other in the third direction D3. Even in the multilayer capacitorC2 ₄, the conductors 11 and 13 constitute dummy conductors that tend notto contribute to generation of capacitance.

In the multilayer capacitor C2 ₄, similarly to the multilayer capacitorC1 ₄, the conductor 11 is located between the second electrode layer E2and the internal electrode 7A that is not electrically connected to thesecond electrode layer E2. Therefore, even in a case where an electricfield is generated between the second electrode layer E2 and theinternal electrode 7A that is not electrically connected to the secondelectrode layer E2, strength of the electric field is small.

The conductor 13 is located between the second electrode layer E2 andthe internal electrode 9A that is not electrically connected to thesecond electrode layer E2. Therefore, even in a case where an electricfield is generated between the second electrode layer E2 and theinternal electrode 9A that is not electrically connected to the secondelectrode layer E2, strength of the electric field is small.

Consequently, the multilayer capacitor C2 ₄ further controls theoccurrence of the migration. Therefore, the second electrode layer E2included in the electrode portion 5 a may not include the region E2 a ₂.Although not illustrated, the second electrode layer E2 included in theelectrode portion 5 a may include the region E2 a ₂.

Next, a configuration of a multilayer capacitor C2 ₅ according to amodification of the second embodiment will be described with referenceto FIGS. 31 to 33. FIGS. 31, 32, and 33 are views illustrating across-sectional configuration of a multilayer capacitor according to themodification of the second embodiment. The multilayer capacitor C2 ₅according to this modification is generally similar to or the same asthe multilayer capacitor C2 ₄ illustrated in FIGS. 28 to 30. However,this modification is different from the multilayer capacitor C2 ₄ in theconfiguration of the conductors 11 and 13. Hereinafter, differencesbetween the multilayer capacitor C2 ₄ and this modification will bemainly described. This modification is similar to the multilayercapacitor C1 ₅ in the configuration of the conductors 11 and 13.

In the multilayer capacitor C2 ₅, the portion 11 a and the portion 11 bare integrated. The conductor 11 includes no end exposed to the surfaceof the element body 3. The conductor 11 is not connected to any of theexternal electrodes 5. The conductor 11 is not electrically connected tothe second electrode layer E2.

The portion 13 a and the portion 13 b are integrated. The conductor 13includes no end exposed to the surface of the element body 3. Theconductor 13 is not connected to any of the external electrodes 5. Theconductor 13 is not electrically connected to the second electrode layerE2.

In the multilayer capacitor C2 ₅, the second electrode layer E2 includedin the electrode portion 5 a may not include the region E2 a ₂. Althoughnot illustrated, the second electrode layer E2 included in the electrodeportion 5 a may include the region E2 a ₂.

Although the embodiment and modifications of the present invention havebeen described above, the present invention is not necessarily limitedto the embodiment and modifications, and the embodiment can be variouslychanged without departing from the scope of the invention.

In each of the modifications illustrated in FIGS. 8 to 19 and 24 to 33,the electrode portion 5 e may include the second electrode layer E2, asin the modifications illustrated in FIGS. 7 and 23.

The multilayer capacitors C1 ₃ to C1 ₆ and C2 ₃ to C2 ₅ may not includethe insulating film 21.

In the present embodiments and modifications, electronic components arethe multilayer capacitors C1, C1 ₁ to C1 ₆, C2, and C2 ₁ to C2 ₅.However, applicable electronic component is not limited to themultilayer capacitor. The applicable electronic component includes, forexample, a multilayer electronic component such as a multilayerinductor, a multilayer varistor, a multilayer piezoelectric actuator, amultilayer thermistor, or a multilayer composite component, orelectronic components other than the multilayer electronic components.

What is claimed is:
 1. An electronic component, comprising: an elementbody of a rectangular parallelepiped shape including a pair of endsurfaces opposing each other in a first direction, a pair of first sidesurfaces opposing each other in a second direction, and a pair of secondside surfaces opposing each other in a third direction; a plurality ofexternal electrodes disposed on both ends of the element body in thefirst direction; a plurality of internal electrodes disposed in theelement body to be distributed in the second direction and electricallyconnected to corresponding external electrodes of the plurality ofexternal electrodes; and an insulating film disposed on the elementbody, wherein each of the plurality of external electrodes includes apair of first electrode portions disposed on the pair of second sidesurfaces and including a conductive resin layer, each of the pair ofsecond side surfaces includes a region exposed from the externalelectrode, the insulating film includes film portions disposed on thepair of second side surfaces, and each of the film portions covers anedge of the conductive resin layer and the region of each of the secondside surfaces along the edge of the conductive resin layer.
 2. Theelectronic component according to claim 1, wherein each of the pluralityof external electrodes includes a pair of second electrode portionsdisposed on the pair of first side surfaces and including a conductiveresin layer, each of the pair of first side surfaces includes a regionexposed from the external electrode, the insulating film includes otherfilm portions disposed on the pair of first side surfaces, and each ofthe other film portions covers an edge of the conductive resin layerincluded in the second electrode portion and the region of each of thefirst side surfaces along the edge of the conductive resin layerincluded in the second electrode portion.
 3. The electronic componentaccording to claim 1, wherein the conductive resin layer includes aplurality of silver particles.
 4. The electronic component according toclaim 1, wherein each of the plurality of external electrodes includes apair of second electrode portions disposed on the pair of first sidesurfaces and including a conductive resin layer, for each of the twoconductive resin layers located on the same first side surface, oneconductive resin layer includes an edge opposing another conductiveresin layer, an outermost internal electrode located outermost in thesecond direction, of the plurality of internal electrodes, is adjacentin the second direction to the second electrode portion to which theoutermost internal electrode is electrically connected, and assumingthat a plane including the end surface to which the outermost internalelectrode is exposed is a reference plane, a first length of theoutermost internal electrode in the first direction from the referenceplane is larger than a second length in the first direction from thereference plane to the edge of the conductive resin layer electricallyconnected to the outermost internal electrode and included in the secondelectrode portion, and smaller than a third length from the referenceplane to the edge of the conductive resin layer not electricallyconnected to the outermost internal electrode and included in the secondelectrode portion.
 5. The electronic component according to claim 4,further comprising: a dummy conductor located in the same layer as theoutermost internal electrode and separated from the outermost internalelectrode, wherein the dummy conductor is electrically connected to theexternal electrode to which the outermost internal electrode located inthe same layer as the dummy conductor is not electrically connected. 6.The electronic component according to claim 1, further comprising: apair of dummy conductors each adjacent to a corresponding first sidesurface of the pair of first side surfaces in the second direction,wherein each of the plurality of external electrodes includes a pair ofsecond electrode portions disposed on the pair of first side surfacesand including a conductive resin layer, and each of the pair of dummyconductors opposes the conductive resin layer not electrically connectedto the internal electrode adjacent to the dummy conductor in the seconddirection and included in the second electrode portion, in the seconddirection.
 7. The electronic component according to claim 1, whereineach of the plurality of external electrodes further includes anelectrode portion disposed on the end surface and including a conductiveresin layer.
 8. An electronic component, comprising: an element body ofa rectangular parallelepiped shape including a pair of end surfacesopposing each other in a first direction, a pair of first side surfacesopposing each other in a second direction, and a pair of second sidesurfaces opposing each other in a third direction; a plurality ofexternal electrodes disposed on both ends of the element body in thefirst direction; and a plurality of internal electrodes disposed in theelement body to be distributed in the second direction and electricallyconnected to corresponding external electrodes of the plurality ofexternal electrodes, wherein each of the plurality of externalelectrodes includes a pair of first electrode portions disposed on thepair of second side surfaces and including a conductive resin layer, foreach of the two conductive resin layers located on the same second sidesurface, one conductive resin layer includes an edge opposing anotherconductive resin layer, the conductive resin layer includes: a firstregion including a plurality of metal particles of a first content and aresin; and a second region including a plurality of metal particles of asecond content smaller than the first content and a resin, and thesecond region is located closer to the edge of the conductive resinlayer than the first region, and includes the edge of the conductiveresin layer.
 9. The electronic component according to claim 8, whereineach of the plurality of external electrodes includes a pair of secondelectrode portions disposed on the pair of first side surfaces andincluding a conductive resin layer, for each of the two conductive resinlayers located on the same first side surface, one conductive resinlayer includes an edge opposing another conductive resin layer, theconductive resin layer included in the second electrode portionincludes: a third region including a plurality of metal particles of athird content and a resin; and a fourth region including a plurality ofmetal particles of a fourth content smaller than the third content and aresin, and the fourth region is located closer to the edge of theconductive resin layer than the third region, and includes the edge ofthe conductive resin layer.
 10. The electronic component according toclaim 8, wherein the metal particles include silver particles.
 11. Theelectronic component according to claim 8, wherein each of the pluralityof external electrodes includes a pair of second electrode portionsdisposed on the pair of first side surfaces and including a conductiveresin layer, for each of the two conductive resin layers located on thesame first side surface, one conductive resin layer includes an edgeopposing another conductive resin layer, an outermost internal electrodelocated outermost in the second direction, of the plurality of internalelectrodes, is adjacent in the second direction to the second electrodeportion to which the outermost internal electrode is electricallyconnected, and assuming that a plane including the end surface to whichthe outermost internal electrode is exposed is a reference plane, afirst length of the outermost internal electrode in the first directionfrom the reference plane is larger than a second length in the firstdirection from the reference plane to the edge of the conductive resinlayer electrically connected to the outermost internal electrode andincluded in the second electrode portion, and smaller than a thirdlength from the reference plane to the edge of the conductive resinlayer not electrically connected to the outermost internal electrode andincluded in the second electrode portion.
 12. The electronic componentaccording to claim 11, further comprising: a dummy conductor located inthe same layer as the outermost internal electrode and separated fromthe outermost internal electrode, wherein the dummy conductor iselectrically connected to the external electrode to which the outermostinternal electrode located in the same layer as the dummy conductor isnot electrically connected.
 13. The electronic component according toclaim 8, further comprising: a pair of dummy conductors each adjacent toa corresponding first side surface of the pair of first side surfaces inthe second direction, wherein each of the plurality of externalelectrodes includes a pair of second electrode portions disposed on thepair of first side surfaces and including a conductive resin layer, andeach of the pair of dummy conductors opposes the conductive resin layernot electrically connected to the internal electrode adjacent to thedummy conductor in the second direction and included in the secondelectrode portion, in the second direction.
 14. The electronic componentaccording to claim 8, wherein each of the plurality of externalelectrodes further includes an electrode portion disposed on the endsurface and including a conductive resin layer.